HDM2HA-19BM4RN10
Carrier tape packaging, rubber core, LCP material terminal, SMT semi gold fog tin shell, DIP Ni plated short type with lock buckle
| Product General Characteristic |
| Product Overview | HDMI CONN. |
| Component Type | Receptacle |
| PCB Mount Type | SMT&DIP |
| Orientation | R/A & V/T |
| Physical Characteristic |
| Housing Material | LCP |
| Contact Material | C2680 |
| Plating Material on Contact Area | Au |
| Plating Thickness on Contact Area | G/F, 15u", 30u" |
| Circuits | 19/21 pin |
| Pitch | 0.5mm |
| Tail Length | Reference drawing dimensions |
| Durability | 1 Cycles |
| Housing Color | Black |
| Electrical Characteristic |
| Current Rating | 0.5A |
| Max. Voltage | 40V AC |
| Solder Process Characteristic |
| Solder Process Type | Reflow Soldering |
| Max. Process Temperature | 260℃ |
| Duration at Max. Process Temperature | 5s |
| Environment Characteristic |
| RoHS / Halogen Free (HF) Compliance | HF |
| Others |
| Packaging | TAPE&REEL/TRAY |